纳米压痕法确定TSV-Cu的应力-应变关系-金属学报.PDF

第50 卷 第6 期 Vol.50 No.6 2014 年6 月 第722-726 页 ACTA METALLURGICA SINICA Jun. 2014 pp.722-726 纳米压痕法确定TSV-Cu 的应力-应变关系* 秦 飞 项 敏 武 伟 (北京工业大学机械工程与应用电子技术学院, 北京100124) 摘要 为得到硅通孔电镀填充铜(TSV-Cu) 的力学性能, 对TSV-Cu 进行了Berkovich 纳米压痕实验. 基于Oliver-Pharr 算法 和连续刚度法确定TSV-Cu 的弹性模量和硬度分别为155.47 GPa 和2.47 GPa; 采用有限元数值模拟对纳米压痕加载过程进 行反演分析, 通过对比最大模拟载荷与最大实验载荷, 确定TSV-Cu 的特征应力和特征应变; 由量纲函数确定的应变强化指 数为0.4892; 将上述实验结果代入幂强化模型中, 确定TSV-Cu 的屈服强度为47.91 MPa. 最终确定了TSV-Cu 的幂函数型弹 塑性应力-应变关系. 关键词 硅通孔电镀填充铜, 纳米压痕, 弹性模量, 屈服强度, 应变强化指数 中图法分类号 TG425.1 文献标识码 A 文章编号 0412-1961(2014)06-0722-05 THE STRESS-STRAIN RELATIONSHIP OF TSV-Cu DETERMINED BY NANOINDENTATION QIN Fei, XIANG Min, WU Wei College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124 Correspondent: QIN Fei, professor, Tel: (010) E-mail: qfei@ Supported by National Natural Science Foundation of China (No Manuscript received 2013-12-03, in revised form 2014-03-18 ABSTRACT In 3D electronic package technologies, through silicon via (TSV) plays a critical important role. TSVs are usually fully filled by electroplating copper, namely TSV-Cu, which has very different mechanical proper- ties from bulk copper. To obtain the mechanical properties of the TSV- Cu, the Berkovich nanoindentation tests were conducted, and the Oliver-Pharr algorithm and the continuous stiffness measurement method were used to ac- quire the elastic modulus and hardness. Then finite element modeling (FEM) simulations are adopted for re