基于螺旋刻划方法的KDP晶体临界切削厚度研究.PDF

40 1 人 工 晶 体 学 报 Vo.l 40 No. 1 2011 2 JOURNAL OF SYNTH ETIC CRYSTALS February, 2011 KDP 陈浩锋, 王建敏, 戴一帆, 郑子文, 彭小强 (, 4100 3) : , KDP ; ; , ; , ; , KDP , 2. 5 nm (R a) : ; KDP; ; : TH 161 : A : 1000-985X( 2011) 01-0022-05 Research on Critical Cutting Thickness of KDP Crystals by Spirally Grooving CHEN H ao-f eng, WANG Jian-m in, DAI Yi-f an, ZHENG Z i-w en, PENGX iao-qiang ( School ofM echatronicsEng ineering andAutom ation, N ationalUniversity ofDefense T echnology, Changsha 4100 3, China) (R eceived ep tem ber 2010) Abstract: In order to achieve the CCT related on the cutting cond ition, a novelmethod of sp iral grooving ofKDP crystals using single diamond toolw as proposed. A calculation for CCT w as established based on the characteristic param eters of m icrograph of groove. The influence of cutting speed and anisotropy of KDP on the CCT w as analyzed. The CCT achieved by novelmethodw asverified by expermi ents of cutting KDP crystals. The results ind icated that the effect of anisotropy of crystals on the CCT is obviously, and the cutting speed in low speed has insignificant influence on theCCT. The cutting parameters are selected accord ing to CCT obtained by method above, ductile mode cutting of KDP crystals in all crystalline orientation can be ach ieved, a super smooth surface w ith roughness of 2. 5 nm (Ra) is achieved. Key wor s: the critical cutting th ickness ( CCT); KDP crystals; ductilemode cutting; spiral grooving 1 引 言 ( KDP), [ 1] , [ 2, 3]